+86-13510071788
取消

XCVM1502-1MSINFVB1369

Part number XCVM1502-1MSINFVB1369
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSALPRIME ACAP FPGA 1369BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$8,384.2500

$8,384.2500

Obtain quotation information
Product parameters
Product Description
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Number of I/O478
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA

Panasonic Electronic Components
CAP TANT 4.7UF 20% 50V RADIAL
Wickmann / Littelfuse
FUSE CLIP CARTRIDGE 250V 15A PCB
Wickmann / Littelfuse
SCR 200V 8A TO220
3M
CONN HEADER VERT 72POS 2.54MM
Wickmann / Littelfuse
FUSE GLASS 1.5A 250VAC 3AB 3AG
Wickmann / Littelfuse
FUSE GLASS 750MA 250VAC 3AB 3AG
Wickmann / Littelfuse
FUSE GLASS 600MA 250VAC 3AB 3AG
Wickmann / Littelfuse
FUSE GLASS 400MA 250VAC 3AB 3AG
关闭
Inquiry
captcha

+86-13510071788
0
0.363233s