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XCVC1702-1MLINSVG1369

Part number XCVC1702-1MLINSVG1369
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSAL AI-CORE FPGA 1369BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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$26,524.3125

$26,524.3125

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Product parameters
Product Description
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Number of I/O500
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA

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