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W979H2KBVX2I

Part number W979H2KBVX2I
Product classification Memory
Manufacturer Winbond Electronics Corporation
Description IC DRAM 512MBIT PAR 134VFBGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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168

$4.0320

$677.3760

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Product Description
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TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusNOT_FOR_NEW_DESIGNS
Package / Case134-VFBGA
Mounting TypeSurface Mount
Memory Size512Mbit
Memory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.14V ~ 1.95V
TechnologySDRAM - Mobile LPDDR2
Clock Frequency400 MHz
Memory FormatDRAM
Supplier Device Package134-VFBGA (10x11.5)
Write Cycle Time - Word, Page15ns
Memory InterfaceParallel
Memory Organization16M x 32
DigiKey ProgrammableNot Verified

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