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AGFB023R31C2I1V

Part number AGFB023R31C2I1V
Product classification System On Chip (SoC)
Manufacturer Intel
Description IC FPGA AGILEX-F 3184FBGA
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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$31,990.5495

$95,971.6485

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Product parameters
Product Description
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TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case3184-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package3184-BGA (56x45)
ArchitectureMPU, FPGA

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